Micron’s Sanand facility, inaugurated on February 28, 2026, will carry out assembly, testing and packaging operations for memory and storage products, with the project investment pegged at about ...

Semiconductor design is rapidly evolving because technologies such as AI and machine learning (ML) applications push the boundaries of complexity and specialization. Modern chips require hundreds or ...

As the semiconductor industry moves to smaller scales, it must overcome several technical challenges. In 2025, we expect three key developments to make headlines: Gate-All-Around transistor designs, ...

The state-of-the-art facility converts advanced DRAM and NAND wafers from Micron's global manufacturing network into finished memory and storage products. Once fully ramped, the first phase of ...

NEW DELHI - India inaugurated its first semiconductor assembly and test facility on Feb 28, a milestone in the government’s push to reduce dependence on foreign chipmakers and stake a claim in a ...

Researchers have invented a new way to align 3D semiconductor chips by shining a laser through concentric metalenses patterned on the chips to produce a hologram. Their work can help to lower the cost ...

Gandhinagar: Prime Minister Narendra Modi will inaugurate an advanced semiconductor Assembly, Testing, Marking and Packaging (ATMP) facility in Sanand on February 28. The inauguration is said to mark ...