Purdue University will recognize the impact of alumnus and semiconductor pioneer John Atalla with the naming of the newest system integration and packaging research institute on campus. The Atalla ...

ASML (ASML) shipped its first advanced packaging lithography system in late 2025 to expand beyond EUV. Taiwan Semiconductor holds over 50% of the high-end CoWoS advanced packaging market for AI chips.

Jinman Han is President of Samsung Semiconductor, Inc. & leads the U.S. business, including Memory, Foundry, System LSI and LED. Almost every innovation introduced to the world has been touted as the ...

Purdue University is working toward the future in microelectronic product development with the creation of the Institute for Advanced System Integration and Packaging (ASIP) to enable faster designing ...

Contrel Technology, an LCD equipment specialist, is increasing its deployment in MicroLED and advanced packaging, which is expected to yield results in 2025. Save my User ID and Password Some ...

Where does advanced packaging stand in 2017? Is it nearing an inflection point? The semiconductor industry is steadily running out of transistor scaling options, so the spotlight is inevitably turning ...

The growing difficulty of cramming more features into an SoC is driving the entire chip industry to consider new packaging options, whether that is a more complex, integrated SoC or some type of ...

Ottawa, Dec. 15, 2025 (GLOBE NEWSWIRE) -- The global advanced packaging market reported a value of USD 40.34 billion in 2025, and according to estimates, it will reach USD 78.75 billion by 2034, as ...

Contrel, a Taiwanese equipment manufacturer, announced during its shareholders' meeting on June 5, 2025 that all proposals had passed. The company emphasized strong growth momentum for 2025, driven by ...

STARKVILLE, MS, UNITED STATES, March 11, 2026 /EINPresswire.com/ — Becker Transactions today announced the exclusive market launch of a patented next-generation LED ...

Advanced IC packaging is a prominent technology highlight of the “More than Moore” arena. At a time when chip scaling is becoming more difficult and expensive at each node, engineers are putting ...